Semiconductors
and flat panels
The manufacturing of semiconductor wafers and flat panel glass substrates takes place in very tightly controlled environments. As such, the equipment used in the making of these products necessitates the highest quality materials.
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Constellium’s extended experience in semiconductor and flat panel display equipment combined with world class manufacturing capabilities make it the ideal partner to manufacturers – both for functional parts (vacuum process and transfer chambers, vacuum valves and pumps, load locks, etc.) and consumable parts (showerheads, diffusers, etc.)
Constellium’s aluminium plates are engineered and manufactured to meet top industry requirements:
- High purity so as to avoid contamination in high temperature environments
- Durability, a parameter essential in producing high-end machinery
- Easier machining thanks to superior flatness and low residual stress
- Consistency in chemical composition to allow reproducibility and improved anodic coating outcomes
- Exceptional dimensional capabilities in width and thickness – to meet increasing demand for larger machinery. Constellium operates some of the largest manufacturing assets worldwide for casting, rolling and stretching plates
Semiconductor and flat panel product offering
Notable alloys within Constellium’s product portfolio include:
- 3003 low zinc
- 5083
- 6061
- 6061 K060 & K068
- 6063S
- 6082
Going further with K060 & K068: “Semiconductor grade” aluminium plates
K060 and K068 solutions - based on alloy 6061 - are the result of optimized chemistry and manufacturing practices, developed throughout the years, for specific end use applications:
- Optimized chemistry for uniform grain size, reduced variation in product properties and better anodizing quality
- Tightly controlled casting for optimum metal cleanliness and reduced porosity in thick plates, thus contributing to minimum outgassing issues and faster pump-down cycles
- Enhanced rolling practices provide the ideal scenario to physically work the center of the plate and eliminate residual porosity from casting as much as possible